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WEB CFD Analysis of joining processes using reactive multilayers on native surface morphologies of microelectronic substrates

Friday (28.02.2020)
10:43 - 10:43 Poster Room
Part of:
- Poster *web*Smoothing of additive manufactured parts using ns-pulsed laser source 1 Dipl.-Ing. Florian Kuisat
- Poster TBA -
- Poster *web*Combustion Synthesis of High Entropy Alloys thin films 1 Dr. Anni Wang
- Poster *web*Surface macro-smoothing and micro-structuring of additive manufactured components by using DLIP technique for controlling wetting characteristics 1 Dipl.-Ing. Florian Kuisat
- Poster *web*Influence of embedding materials on heat transfer and ignition transfer time in heterogeneous reactive material system 1 Mostafa Baloochi
- Poster TBA -
- Poster *web*Self reactive joining process with multilayer foils in lap joint configuration 1 Marcus Glaser
- Poster *web*Thermodynamics and kinetics of phase formation in magnetron-sputtered Ni/Al multilayer thin films with nanoscale morphology 1 Sascha Sebastian Riegler
- Poster *web*Femtosecond laser approach to cut Ni/Al reactive foils without ignition of a self-propagation reaction 1 Maria Amelia Martins
- Poster *web*Effect of preparation angle on atom probe tomography of reactive multilayers 1 Christian Schäfer
- Poster *web*Reactive Ni/Al multilayers with 3D Morphologies 1 Konrad Jaekel
- Poster *web*Synchrotron radiation X-ray powder diffraction and magnetometric study of natural and synthetic terms of the stannite-kesterite pseudobinary system in the low temperature regime (5-275 K) 1 Dr. Francesco Di Benedetto
- Poster *web*Coating and Drying of Sodium-Ion-Battery Electrodes 1 Julian Klemens
- Poster *web*Analytical prediction model for Direct Laser Interference Patterning 1 Dr. Bogdan Voisiat
- Poster *web*CFD Analysis of joining processes using reactive multilayers on native surface morphologies of microelectronic substrates 1 Erik Wiss
- Poster *web*Top-Hat profile in Direct Laser Interference Patterning: Is it worth it? 1 Mikhael El-Khoury
- Poster *web*Laser-based (“2D”) surface treatment of lithium-ion battery electrodes to improve the rate capability 1 Jens Sandherr
- Poster *web*Microstructure investigation of superconducting NbN thin films on copper 1 Dipl.-Ing. Ying Li
- Poster TBA -
- Poster *web*Laser functionalized PEEK-based coating systems to minimize friction and wear 1 Dr. Tim Kunze
- Poster *web*Structure and Dynamics in a Layered Na-ion Battery Cathode 1 Euan Bassey
- Poster *web*Electrode-Processing using porous nano-structured Na3V2(PO4)3 (NVP) for Sodium-Ion Batteries 1 Luca Schneider
- Poster TBA -
- Poster *web*Experimental Approach for Phase Diagram determination of Li alloys 1 Joel Fels
- Poster *web*Process Integration of Few-Layer MoS2 into a-Si:H Heterojunction pin-Photodiodes for extended Infrared Detection 1 Charles Otieno Ogolla
- Poster *web*Ti3SiC2- and Ti3AlC2-based ceramics synthesis by spark plasma sintering of preceramic paper 1 Elizaveta Sedanova
- Poster *web*Overheating microstructural study of nickel-based superalloys from turbine blades of aircraft engines 1 Dr. Ana Pastor
- Poster *web*Electrochemical thermodynamics of Lithium Batteries and their materials 1 Prof. Dr. Hans Jürgen Seifert
- Poster *web*Corrosion Analysis of a 316L Stainless Steel Gas Outlet Sealed with a Copper Ring Used in the CO2 Methanation Process 1 Ananya Prechavut
- Poster *web*Self-propagating reaction of structured reactive Al/Ni multilayers 1 Yesenia Sauni
- Poster *web*3D structured electrodes for Li-ion batteries using open porous metal foams as current collector for high energy application 1 Jonas Oehm
- Poster *web*Novel air stable single source precursor for homogeneous crystalline TiS2 thin films 1 Anja Sutorius
- Poster *web*Synthesis of nickel-copper composite with controllable nanostructure through facile solvent control as positive electrode for high-performance supercapacitors 1 Dr. Damin Lee
- Poster *web*Towards understanding response generation in conductometric gas sensors 1 Stefan Kucharski
- Poster Effects of 3D electrode design on high-energy silicon-graphite anode materials 1 Yijing Zheng

Session -F: Functional Materials, Surfaces, and Devices
Belongs to:
Topic X: Poster Session

The interest in using reactive multilayers in manufacturing microelectronics has increased due to the growing need to assimilate diverse components on PCB’s with conflicting coefficients of thermal expansion. Owing to these disparate components conventional methods of manufacturing can lead to unwanted loads being induced on surrounding structures. Computational Fluid Dynamics (CFD) can be used to show the relative reduction in thermal loading, and therefore induced stresses and potential manufacturing defects, through the appropriate deployment of reactive foils compared to the thermal loading incurred during reflow soldering, for example.

The CFD model presented here is effectively a shoebox model created in ANSYS Fluent housed within a large volume of air to incorporate the heat exchange with the surroundings. The shoebox model contains several layers, namely the ceramic substrate with embedded thermocouples, a reactive multi-layer foil, solder and a silicon chip. The idea of incorporating the thermocouples into the model is to later use the temperature-time history measurements for direct comparison with experimental measurements.

The reaction, and the exothermic heat release thereof, was approximated through a user-defined function (UDF) which was used to specify the distribution of heat source terms within the reactive foil and how this propagated with respect to time. This function was effectively a probability density function (PDF), which propagated in the direction of the reaction, where the use of the PDF allowed for a reliable prescription of the peak energy intensity, the reaction width, as well as the reaction speed.

The results are able to show the solder both melting as a result of the reaction, in addition to the solidification after the reaction has taken place. Furthermore, the temperature-time profiles of the entire domain, with respect to each time step, have been ascertained and these can later be compared with experimental measurements at the respective thermocouple locations. The quantity of energy release required during the reaction, in order to melt the entire solder, was determined and this is demonstrates how the CFD approach can be a very useful design tool in determining the number of layers required to melt a certain quantity of solder, as opposed to a more expensive trial and error approach in the field.

Erik Wiss
Saarland University
Additional Authors:
  • Dr. Adam Yuile
    Saarland University
  • Sascha Riegler
    Saarland University
  • Alexander Schulz
    Technical University Ilmenau
  • Dr. Isabella Gallino
    Saarland University
  • Prof. Dr. Jens Müller
    Technical University Ilmenau
  • Prof. Dr. Steffen Wiese
    Saarland University